Multimedia Card Standard
- System Specification 4.3 Compliance
- SPI Mode Supported
- Support Command Class 0~7
- Address Misalignment Read allowance
- Support clock frequencies 0 ~ 52MHz
- Damage free for Card Hot-Swap
- Programmable Read-Block-Length supported from 1 to 1024
- Write-Block-Length 512
- Support different Bus width: x1, x4, x8
- Support dual controller voltage 2.7V~3.6V and 1.7V~1.95V.
- Support two flash voltage 2.7V~3.6V and 1.7V~1.95V.
- Support vendor command to change driving strength
SD Card Standard
- System Specification 2.0 Compliance
- Support CPRM
- SPI Mode Supported
- Support Command Class 0~7, 8, 10
- Address Misalignment Read allowance
- Support clock frequencies 0 ~ 50MHz
- Programmable Read-Block-Length supported from 1 to 512
- Write-Block-Length 512
- Support different Bus width: x1, x4
- Support exFAT file system
Fully comply with BANAND 1.0 Standard
- System Specification BA NAND1.0 Compliance
- Support two voltage range (2.7 ~ 3.6V and 1.7V~ 1.95V) with different configurations
- Support 8 bit data bus
- Read/Write cycle time 20ns ~ @Timing mode 5
- Support Metadata : 1 ~ 2 byte @ 512 byte
- Support multiple sector
Dual Voltages MMC supported
- 1.65 ~ 1.95V Confidential
- 2.7 ~ 3.6V
High capacity supported
- Card capacity is up to 2TB
Fastest data transfer rate on the market
- Both single/dual channel data access
- Byte mode/word mode interleave
- High performance DMA transfer
NAND Flash Interface
- Support 4 chip enable signals
- ECC Support
BCH: 6 bit, 8 bit and 12~14bit for 512B correction ECC
BCH: 24bit/1KB correction ECC
- Large Block SLC/MLC NAND Type Flash ( 2KB/page, 4KB/page, 8KB/page )
Samsung, Intel, Micron, Toshiba, Hynix/STMicro
- Support synchronous flash
Samsung Toggle NAND
Intel/Micron ONFI 2.0
8-bit 8051 Micro-controller with enhanced features
- Multiple clock rate
- 1 clock per instruction cycle
- Embedded RAM and ROM
Interface to ISO-7816
- GPIO for IO
- GPIO for CLK 1M~5MHz
- GPIO for Reset
Automatic power saving operation
- Standby current : 100uA (Temp=25°C, VCC=3.6V)
- Operating current : 20mA (Temp=25°C, VCC=3.3V)
ESD for both front end and back end
- Human ************ model: ±2 KV 100 pf/1.5 KOhm
- Machine mode: ±0.2 KV 200 pf/0 Ohm
- Contact discharge: ±4 KV 150 pf/330 Ohm
Operating temperature: -25 to 85 degree C
53-PLGA packages or Die bond
- L-type pad arrangement for stack die with flash
- Small foot print package
53-PLGA (3.8mmx7mm)